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TE AI Cup

Team Full

Year-long industry competition solving a real TE Connectivity manufacturing problem, with scholarships and patents on the line.

Project Manager
Sanchay Devnath

Advisor · Shu Wang

Computer Vision Process Control
Ran
6 editions since Fall 2021
Commitment
~10 hrs/week
Openings
3-4

Results

  • ★ 1st National / 2nd Global (2026)
  • ★ 2nd National / 3rd Global (2025)
  • ★ 1st National / 2nd Global (2024)

Every year we've competed

  • 2026 1st National / 2nd Global
  • 2025 2nd National / 3rd Global
  • 2024 1st National / 2nd Global
  • 2023
  • 2022
  • 2021

What you need coming in

ML knowledge, presentation skills, and a lot of commitment.

We are awaiting confirmation for details from TE Connectivity for this year.

TE AI Cup is an annual international collegiate competition with over 40 universities competing. Teams work with professionals from TE Connectivity to fix a real-world issue and have an impact on their business, with the opportunity to patent the team’s work. This is a year-long commitment, with a presentation to TE’s executives in May.

ML@Purdue has competed every year since 2021, with a history of excellence in this competition — annually reaching the top-3 podium and receiving large scholarship and monetary prizes. Because a new team enters each cycle, this page covers the program as a whole rather than any single year.

Typical project tracks

The topic changes every year, but projects generally fall into one of three areas.

AI Machine Vision (AIMV) — AI sorting, defect inspection, defect location, dimensional measurement, vision guidance, 3D vision.

AI Process Control & Optimization — manufacturing process variation minimization, anomaly detection and prevention for manufacturing processes, EHS, power consumption monitoring and control, AI-based process control and optimization.

General AI Applications — AI for product design, business execution, planning, demand forecasting, inventory control, tooling management, quality improvement, SAP, logistics, and marketing.